JAPANESE
Booth No.: E15-33
Evolution of 3D-MID.
Proposal of 3D mounting from 3D-MID manufacturing.
Exhibited Products / Technologies (Manufacturer)
3D-MID(Molded Interconnect Device)
3D-MID technology has the possibility for 3D mounting by the wiring of 3D direct electric circuit on the surface of the resin molded products.
 
Automotive Application
3D-MID(Molded Interconnect Device)
3D-MID technology has the possibility for 3D mounting by the wiring of 3D direct electric circuit on the surface of the resin molded products.
 
Wearable Application
3D-MID(Molded Interconnect Device)
3D-MID technology has the possibility for 3D mounting by the wiring of 3D direct electric circuit on the surface of the resin molded products.
 
Robot/Robotics Application
3D-MID(Molded Interconnect Device)
3D-MID technology has the possibility for 3D mounting by the wiring of 3D direct electric circuit on the surface of the resin molded products.
 
Company Information
URL:Exhibitor's Official Website
Department/Division:Business development support part TEL:81-3-53967821
  
Co-exhibitor
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