JAPANESE
Booth No.: E29-2
LED Packaging Solution of Mitsubishi Materials Corp.
Exhibited Products / Technologies (Manufacturer)
Heatsink direct bonded LED Substrate
NEW World's First World Premiere
Heatsink direct bonded DBA Substrate for LED Head Lamp is reliable and low thermal resistance.

High temperature AuSn alloy solder paste
This AuSn alloy solder paste has an excellent bonding reliability even at high temperature, so it can safely be used for vehicle installations, high brightness LEDs, power semiconductors and communication modules.

Ag sintering paste for bonding
This Ag sintering paste is a new bonding material for high brightness LEDs and power semiconductors.
For a bonding strenght equivalent to Tin solder pastes, the thermal conductivity is higher than twice better, just by bonding at 150 dgree C, even without applying pressure.

Core Shell type TLP bonding material
TLP (Transient Liquid Phase) bonding material is the next generation of bonding material for power semiconductors.
By using a unique structure of core-shell powder, the formation of intermetallic compounds can be achieve very fast.

Low thermal resistance and high heat resistance MCPCB
Polyamide-imide (PAI) based-MCPCB for LED & power modules are created, using a newly developed composite, made of PAI and a ceramic filler, with extremely low thermal resistance(0.1 Kcm2/W)and high heat resistance.
A combination of this composite with flexible substrates, folded substrates and heatsinks is currently under further investigation.
 
Automotive Application
Heatsink direct bonded LED Substrate
NEW World's First World Premiere
Heatsink direct bonded DBA Substrate for LED Head Lamp is reliable and low thermal resistance.






Low thermal resistance and high heat resistance MCPCB
Polyamide-imide (PAI) based-MCPCB for LED & power modules are created, using a newly developed composite, made of PAI and a ceramic filler, with extremely low thermal resistance(0.1 Kcm2/W) and high heat resistance.
A combination of this composite with flexible substrates, folded substrates and heatsinks is currently under further investigation.
 
Exhibitors' Presentation
Date / Time Venue Presentation Title / Abstract
Jan 17 [Wed]
13:40 ~ 14:40
East-A MITSUBISHI MATERIALS CORP.

High Power LED Packaging Solution
 
Company Information
URL:Exhibitor's Official Website
Department/Division:sales div. TEL:81-3-5819-7320
  
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