JAPANESE
Booth No.: E21-20
Global number 1 partner for creating optimized surfaces by precise polishing "CMP"
Details
CMP is polishing technology to achieve advanced surface. It's already necesarry to front end process of semiconductor and recently it's applying to back end process as well. CMP is able to achieve defect free and fine surface quality and capable to various materials such as resin, ceramics and SiC.
Exhibited Products / Technologies (Manufacturer)
CMP Polishing Slurry
NEW
We offer a various kind of slurries to resin, ceramics and SiC. They brings high removal rates and excellent surface quality through its optimized particle design.

CMP Polishing Pad
NEW
Our polishing pads show excellent polishing capacity through the fusion of technologies developed for semiconductor and our unique foaming technologies. They succeed in producing excellent planarity, consistency and scratch-free.
 
Company Information
URL:Exhibitor's Official Website
Department/Division:NITTA HAAS Inc. TEL:81-774-68-1043
  
Co-exhibitor
ROHM AND HAAS ELECTRONIC MATERIALS K.K.
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