JAPANESE
Booth No.: E26-15
3-D Deformation Measurement for Semiconductor Package by DIC (Digital Image Correlation)
Exhibited Products / Technologies (Manufacturer)
3-D Deformation Measurement for Semiconductor Package by DIC (Digital Image Correlation)
NEW
Non-contact optical method to measure the 3-D (X/Y/Z) deformation on the surface of the specimen. Correlation of reference condition to a series of deformed conditions by tracking the changes in an applied micro pattern. CTE can be measured too, not only deformation.

Plan Optik Class Wefers ( Plan Optik AG )
NEW
Plan Optik AG is the leading mnufacturer of structured wafers when it comes to technology. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals these wafers are essential components used as active elements for numerous applications in MEMS technology.
 
Company Information
URL:Exhibitor's Official Website
Department/Division:Industrial Machinery & Materials Dept. TEL:81-3-5211-1813
  
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